IC制造 -- 晶圆探针测试（Chip Probing）
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三、CP测试的目的 CP测试（Chip Probing），是芯片制造流程中的关键环节，主要目的是： 1. 筛选不合格芯片，降低封装成本： 通过对晶圆上每个裸片（Die）进行电气性能和功能测试，及时发现并剔除不合格芯片，避免将有缺陷的芯片送入封装阶段，从而降低封装 ...
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