知乎盐选 | 1.2 集成电路制造流程
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在 CMOS 工艺过程中，通常按照工艺模块分为前道工艺（front end of line，FEOL）、中道工艺（middle of line，MOL）和后道工艺（back end of line，BEOL）。前道工艺包括制造有源区、阱区、栅极、源极和漏极等；后道工艺包括制造金属互连线及金属通孔，目前的先进节点（0.18μm 及更先进节点）大多选用铜作为 ...
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