半导体芯片制造的“前道工艺”、“中道工艺”和 ...
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一、 前道工艺(Front-End-of-Line, FEOL) 定义与作用: 前道工艺是晶圆制造的核心阶段,通过在硅基片上形成晶体管、电容等电子元件,构建集成电路的基础结构。 其核心目标是通过光刻、刻蚀等技术实现纳米级器件图形化,直接影响芯片性能和良率1713。
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