半导体制造前道和后道怎么区分? - 知乎
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前道工序（Front - End Of Line，FEOL）：也称为晶圆制造，主要是在半导体晶圆上构建集成电路的核心结构，是从原始的硅晶圆开始，通过光刻、刻蚀、掺杂、薄膜沉积等一系列复杂工艺，在晶圆上制造出晶体管、二极管等有源器件以及电阻、电容等无源器件，并 ...
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