硅农 - 知乎
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半导体的工艺流程一般分为三段，即 FEOL:前段,主要包含浅槽隔离模组，阱形成模组，器件模组 MEOL:中段,一般指接触孔模组 BEOL:后段,主要包含金属互连线模组 前段时间为大家介绍了55/65nm后段工…
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