半导体测试中， lot、 wafer、 bin、 die的含义是什么？
12 September 2025 admin
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答案： 在半导体测试的语境中： * lot指的是整个生产批次。 * wafer即晶圆，是半导体制造的基础。 * bin通常用来指代分类或区间，如产品性能的分级。 * die则是晶圆上的单一芯片。 解释： 在半导体的生产过程中，每一个环节都极为重要。测试环节是对产品质量的关键把控。在描述这些术语时，我们 ...
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